User Guide
Specifications: Dell OptiPlex G1 Systems

Specifications: Dell OptiPlex G1 Systems

General | System Information | Expansion Bus | System Clocks | Memory | Drives | Ports | Video | Supported Resolutions | Power | Physical | Environmental | Regulatory Notices

General

Microprocessor type Intel Pentium II or Celeron™ microprocessor with MMX™ technology 
Microprocessor speeds:  

Pentium

266, 300, 333, 350, 400, or 450 MHz

Celeron

266, 300, 333, and 400 MHz
Internal cache 32 KB (16-KB data cache, 16-KB instruction cache)
L2 cache memory:  

Pentium

512-KB pipeline burst, four-way set-associative, write-back SRAM

Celeron

128 KB for processors 300 MHz and above
Math coprocessor internal to the microprocessor
Microprocessor slot slot 1

System Information

System chipset Intel 440BX AGP set

PIIX4e controller

82371EB

PCI, AGP controller

82443BX PAC
Data bus width 64 bits
Address bus width 32 bits
DMA channels eight
Timers three
Interrupt levels 15
Flash EPROM (BIOS) 2 Mb
BIOS source Dell
NIC controller chip optional integrated 3Com PCI 3C905B-TX Wakeup On LAN NIC, operating at 10 or 100 Mbps
I/O controller chip National PC87309

Expansion Bus

Bus type PCI (2.1-compliant) and ISA
PCI expansion-card connectors:  

Low-profile chassis

two (one PCI connector and one ISA connector share an expansion-card slot)

Midsize chassis

three (one PCI connector and one ISA connector share an expansion-card slot)
or
five (two PCI connectors share expansion-card slots with ISA connectors)

Mini tower chassis

five (two PCI connectors share expansion-card slots with ISA connectors)
ISA expansion-card connectors:  

Low-profile chassis

two (one ISA connector and one PCI connector share an expansion-card slot)

Midsize chassis

three (one ISA connector and one PCI connector share an expansion-card slot)
or
two (both PCI connectors share expansion-card slots with ISA connectors)

Mini tower chassis

four (two ISA connectors share expansion-card slots with PCI connectors)
Bus speeds PCI: 33 MHz
ISA: 8.33 MHz
PCI data transfer rate 130 MB/sec (132-MB/sec burst)
Plug and Play BIOS and ISA Bus revision 1.0A
PCI bus specification complies with PCI specification 2.1
PCI-to-PCI bridging supported
ISA connector data width 16 bits
PCI connector data width 32 bits (maximum)

System Clocks

Diskette/communications ports 48 MHz from system clock
System clock 66 or 100 MHz
Keyboard controller 48 MHz

Memory

Architecture 64-bit (non-ECC/nonparity), noninterleaved
Wait states near zero
DIMM sockets two (gold contacts)
DIMM capacities 32-, 64-, and 128-MB SDRAM ("PC100" 100 MHz, 10 ns)
Minimum RAM 32 MB
Maximum RAM 256 MB
Memory access time synchronized with system clock
BIOS address F0000h

Drives

Externally accessible bays:  

Low-profile chassis

one 5.25-inch bay for a removable media device; one 3.5-inch bay for a diskette drive

Midsize chassis

two 5.25-inch bays for removable media devices; one 3.5-inch bay for a diskette drive

Mini tower chassis

three 5.25-inch bays for removable media devices; one 3.5-inch bay for a diskette drive
Internally accessible bays:  

Low-profile chassis

one 3.5-inch bay for a 1-inch–high hard-disk drive

Midsize chassis

two 3.5-inch bays for either one or two 1-inch–high hard-disk drives, or one 1-inch-high hard-disk drive and one 1.6-inch–high hard-disk drive

Mini tower chassis

two 3.5-inch bays for either one or two 1-inch-high hard–disk drives, or one 1-inch-high hard-disk drive and one 1.6-inch–high hard-disk drive

Ports

Externally accessible:  

Serial (DTE)

two 9-pin connectors (16550-compatible)

Parallel

25-hole connector (bidirectional)

Video

15-hole connector

NIC

RJ45 connector

PS/2-style keyboard

6-pin mini-DIN

PS/2-compatible mouse

6-pin mini-DIN

USB

two USB-compliant connectors
Internally accessible:  

Primary EIDE hard-disk drive

40-pin connector on PCI local bus

Secondary EIDE hard-disk drive

40-pin connector on PCI local bus

Diskette drive

34-pin connector

ATI Multimedia Channel (AMC)

40-pin connector

Video

Video type integrated ATI Rage IIC
(baseline AGP) graphics
Video memory 2 MB standard (upgradable to 4 MB) SGRAM

Supported Resolutions

Video Resolution Maximum Color Depth Maximum Refresh Rate Minimum SGRAM Required
640 x 480 True-color (32 bpp) 85 Hz 2 MB
800 x 600 True-color (32 bpp) 85 Hz 2 MB
1024 x 768 65,536 colors (16 bpp) 85 Hz 2 MB
1280 x 1024 256 (8 bpp) 85 Hz 2 MB
1024 x 768 True-color (32 bpp) 85 Hz 4 MB
1280 x 1024 65,536 colors (16 bpp) 85 Hz 4 MB
1600 x 1200 65,536 colors (16 bpp) 75 Hz 4 MB

Power

DC power supply:  

Wattage

low-profile chassis: 145 W;
midsize chassis: 200 W;
mini tower chassis: 200 W

Voltage

90 to 135 V at 60 Hz;
180 to 265 V at 50 Hz

Heat dissipation

low-profile chassis: 808 BTU/hr (nominal);
midsize chassis: 913 BTU/hr (nominal);
mini tower chassis: 913 BTU/hr (nominal)

Backup battery

3-V CR2032 coin cell

Physical

Low-profile chassis:  

Weight

10.9 kg (24 lb)

Height

10.9 cm (4.3 inches)

Width

40.9 cm (16.1 inches)

Depth

43.7 cm (17.2 inches)
Midsize chassis:  

Weight

12.7 kg (28 lb)

Height

16.5 cm (6.5 inches)

Width

41.9 cm (16.5 inches)

Depth

44.5 cm (17.5 inches)
Mini tower chassis:  

Weight

14.9 kg (33.0 lb) or more, depending on options installed

Height

44.4 cm (17.5 inches)

Width

20.6 cm (8.1 inches)

Depth

43.7 cm (17.2 inches)

Environmental

Temperature:  

Operating

10o to 35oC (50o to 95oF)

Storage

–40o to 65oC (–40o to 149oF)
Relative humidity 20% to 80% (noncondensing)
Maximum vibration:  

Operating

0.25 G at 3 to 200 Hz at 1 octave/min

Storage

0.5 G at 3 to 200 Hz at 1 octave/min
Maximum shock:  

Operating

left side (for computers operating in a vertical orientation) and bottom half-sine pulse with a change in velocity of 50.8 cm/sec (20 inches/sec)

Storage

27-G faired square wave with a velocity change of 508 cm/sec (200 inches/sec)
Altitude:  

Operating

–16 to 3048 m* (–50 to 10,000 ft)

Storage

16 to 10,600 m (50 to 35,000 ft)
* The maximum operating temperature of 35C (95F) is for altitudes below 914.6 m (3000 ft). Above 914.6 m, the maximum operating temperature is reduced.

Regulatory Notices

 
FCC (U.S. only) Class B (low-profile and midsize chassis)
Class A1, Class B2 (mini tower chassis)
IC Notice (Canada only) Class B
CE Notice Class B
DMI 3.0-compliant  
APM 1.1-compliant  
FCC ID Class B
EN 55022 (Czech Republic only) Category B
VCCI Notice (Japan only) Class A ITE, Class B ITE
MOC Notice (South Korea only) Class A Device, Class B Device
NOM Information (Mexico only)  
Polish Center for Testing and Certification  
BCIQ Notice (Taiwan only)  
1 For the mini tower chassis when networked
2 For the mini tower chassis when in stand-alone mode
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